Thermal adhesive bond
Following the trend to lightweight construction, breaking new ground in connection technology is essential. The TSS system allows placing of plastic bosses in sandwich structures, which consist of a honeycomb or foam core with outer layers of fiber-reinforced plastics (e.g., CRP or GRP). During the TSS joining process, the plastic components are melted, creating a thermal adhesive bond. Placing the plastic bosses is carried out with or without a pilot hole and can be implemented with robotic assistance.